Supplier profile
DISCO HI-TEC EUROPE GmbH
Every public-sector award we hold for this supplier, across Germany, Finland, France, the UK, Ireland, Italy, Poland, Portugal and UK, from 30 Nov 2010 to 7 May 2026.
Awards won
36
all time
Attributed value
£322k + €5.1m
1 shared, unvalued
Buyers
24
public bodies
Active
2010–2026
first to latest award
Awards by year
Who they win from
| Buyer | Awards | Value |
|---|---|---|
| UNIVERSITY OF SOUTHAMPTON | 1 | £181k |
| Royal Holloway and Bedford New College (known as Royal Holloway, University of London) | 1 | £74k |
| University of St Andrews | 1 | £67k |
| Fraunhofer-Gesellschaft - Einkauf B12 | 6 | not attributable |
| Sieć Badawcza Łukasiewicz - Instytut Mikroelektroniki i Fotoniki | 3 | €893k |
| CEA/Grenoble | 2 | €1 |
| Deutsches Zentrum für Luft- und Raumfahrt e.V. (DLR) | 2 | not attributable |
| Fraunhofer-Gesellschaft, Einkauf B12 | 2 | not attributable |
| Universität Stuttgart | 2 | €248k |
| VTT Technical Research Centre of Finland Ltd | 2 | €1.1m |
What they win
Awards
Showing 1–25 of 36 awards we hold
- Germany – Laboratory, optical and precision equipments (excl. glasses) – Wafersäge ↗Universität Stuttgart€124kawarded 7 May 2026
- Wafersäge ↗Universität Stuttgart€124kawarded 6 May 2026
- France – Microelectronic machinery and apparatus – Livraison, installation, mise en service et formation à l’utilisation d’une scie de découpe de précision pour le C2N du CNRS ↗Centre National de la Recherche Scientifique Délégation Ile de France Gif sur Yvette€440kawarded 27 Feb 2026
- Finland – Miscellaneous general and special-purpose machinery – Semi-Automatic Wafer Grinder ↗VTT Technical Research Centre of Finland Ltd€325kawarded 3 Feb 2026
- Poland – Miscellaneous special-purpose machinery – Dostawa piły do cięcia podłoży półprzewodnikowych ↗Sieć Badawcza Łukasiewicz - Instytut Mikroelektroniki i Fotoniki€350kawarded 29 Dec 2025
- Germany – Miscellaneous special-purpose machinery – Sägemaschine mit passendem Kühlungs- und Filtersystem - PR1043475-2450-W ↗Fraunhofer-Gesellschaft, Einkauf B12awarded 22 Dec 2025
- Sägemaschine mit passendem Kühlungs- und Filtersystem - PR1043475-2450-W ↗Fraunhofer-Gesellschaft, Einkauf B12awarded 22 Dec 2025
- Germany – Rotary and abrasive instrument – Panel Level Grinder (IZM-68) - PR289446-2590-P ↗Fraunhofer-Gesellschaft - Einkauf B12awarded 24 Nov 2025
- Panel Level Grinder (IZM-68) - PR289446-2590-P ↗Fraunhofer-Gesellschaft - Einkauf B12awarded 24 Nov 2025
- Germany – Miscellaneous special-purpose machinery – Grinder (ISIT07a.2) + deionized water recycling unit for grinder (ISIT07a.4) - PR879727-2390-P ↗Fraunhofer-Gesellschaft - Einkauf B12awarded 26 Aug 2025
- Grinder (ISIT07a.2) + deionized water recycling unit for grinder (ISIT07a.4) - PR879727-2390-P ↗Fraunhofer-Gesellschaft - Einkauf B12awarded 25 Aug 2025
- Poland – Machine tools – Dostawa automatycznej piły do precyzyjnego cięcia materiałów półprzewodnikowych, ceramiki i kompozytów wraz z osprzętem do mocowania materiału i zestawem ściernic tnących. ↗Sieć Badawcza Łukasiewicz - Instytut Mikroelektroniki i Fotoniki€253kawarded 15 Jul 2025
- High Precision Wafer Grinding System for Tyndall National Institute (UCC) ↗University College Cork€220kawarded 16 Apr 2025
- Poland – Checking and testing apparatus – Dostawa zestawu urządzeń do pocieniania podłoży półprzewodnikowych oraz separacji podłoży na kawałki (chipy) wraz z urządzeniami pomocniczymi ↗Centrum Zaawansowanych Materiałów i Technologii CEZAMAT Politechniki Warszawskiej€849kawarded 28 Mar 2025
- France – Laboratory, optical and precision equipments (excl. glasses) – Acquisition d'une machine de découpe de précision pour WAFERS ↗CNRS-Délégation Centre-Est€200kawarded 30 Oct 2024
- France – Microelectronic machinery and apparatus – Fourniture d'un équipement de découpe laser ↗CEA Grenoble€1awarded 9 Oct 2024
- Trennschleifen IZHH ↗Deutsches Zentrum für Luft- und Raumfahrt e.V. (DLR)awarded 28 Jun 2024
- Germany – Laboratory, optical and precision equipments (excl. glasses) – Trennschleifen IZHH ↗Deutsches Zentrum für Luft- und Raumfahrt e.V. (DLR)awarded 19 Jun 2024
- France – Microelectronic machinery and apparatus – Fourniture d’un équipement d’amincissement "Wafer to Wafer" et "Die to Wafer" ↗CEA/Grenoble€1awarded 18 Jun 2024
- France-Grenoble: Microelectronic machinery and apparatus and microsystems ↗institut polytechnique de Grenoble€195kawarded 22 Dec 2023
- Acquisition d'un équipement de découpe de semi-conducteurs ↗Institut polytechnique de Grenobleawarded 22 Dec 2023
- Germany – Miscellaneous special-purpose machinery – Wafersage - PR473177-2480-W ↗Fraunhofer-Gesellschaft - Einkauf B12awarded 21 Dec 2023
- Wafersaw - PR473177-2480-W ↗Fraunhofer-Gesellschaft - Einkauf B12awarded 19 Dec 2023
- Finland-Espoo: Miscellaneous general and special-purpose machinery ↗VTT Technical Research Centre of Finland Ltd€739kawarded 11 Sept 2023
- Wafer Dicing Saw ↗University of St Andrews£67kawarded 26 May 2023
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Awards are collected from official public procurement notices and deduplicated so one procurement counts once. Supplier names are grouped across their published spellings: case and punctuation are ignored, and “Ltd” is treated as optional because buyers routinely leave it off. Everything else that marks a different organisation is kept — an LLP, a plc, a CIC and a Teoranta are separate businesses from a Ltd of the same name, as are a parent and a named subsidiary, and none of them are merged here. Where another entry differs from this one only by legal form or a bracketed qualifier it is listed above as possibly the same organisation — a hint for the reader, never a merge: figures are per legal entity and never combined. Value is attributed only where the notice is explicit: the supplier's own itemised amount, or the whole value where they were the sole named supplier. Awards naming several suppliers without a published split are counted and marked shared, never valued, and a framework ceiling is never treated as money any one appointed supplier won. Sterling and euro are never added together. The linked source notice is authoritative.
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