PECVD System and Ion Beam Etching Tool

Description

The University is seeking to purchase a PECVD System and Ion Beam Etching Tool.

Key facts

Procedure

Award procedure without prior publication of a call for competition

Lots

1

Contact

Stuart Linton

slinton2@ed.ac.uk

+44 1316502759

Category

goods

Awarded suppliers

• Oxford Instruments Nanotechnology Tools Ltd · GB-FTS-156329 · UK

Ground given for limiting competition

The buyer’s own stated reason for awarding without open competition, as published. Their assertion, not a finding.

The University requires a 2D Materials Processing Suite to establish a new cleanroom capability for growing and processing atomically thin materials, including graphene, molybdenum disulphide (MoS₂), tungsten disulphide (WS₂) and hexagonal boron nitride (hBN). The suite must comprise two complementary systems: - Plasma-assisted Chemical Vapour Deposition (CVD) system: Must incorporate a loadlock, support a minimum eight-line gas delivery system, enable the growth of graphene and transition metal dichalcogenides, and operate at temperatures up to 1,200°C. - Ion Beam Etching (IBE) system: Must provide sub-nanometre etching precision, Secondary Ion Mass Spectrometry (SIMS) endpoint detection and Chemical Assisted Ion Beam Etching (CAIBE) using fluorine-based chemistry. - A critical requirement is a retractable SIMS probe that can be safely withdrawn during CAIBE processing to prevent damage from highly reactive gases, while retaining endpoint detection capability during conventional etching processes. Oxford Instruments has been identified as the only manufacturer able to provide a combined solution meeting all the specified technical requirements, particularly the integration of SIMS endpoint detection with a retractable probe capable of supporting CAIBE processing. This functionality is essential for accurately processing extremely thin materials, where conventional plasma etching risks removing underlying material. The proposed equipment will establish the required 2D materials research capability while also enhancing existing thin-film processing workflows within the University's cleanroom.