Denmark – Machines and apparatus for testing and measuring – One Photonic Wafer Probe Station and one Photonic Assembly Station

Description

The tender concerns a photonic wafer probe station to characterise the quality of photonic integrated circuits (PICs). It should be possible to characterise both optical and electrical performance. For the optical characterisation, the main coupling in/out technique will be through grating couplers but the equipment should be possible to be configured also for edge coupling. In this case, different holders and fibers may be needed. The electrical characterstics are to be characterised both in DC as well as RF up to 40GHz using probe and/or probe cards.

Key facts

Procedure

open

Submit via

https://eu.eu-supply.com/app/rfq/rwlentrance_s.asp?PID=461519&TID=200421875&B=

Contact

lplaa@dtu.dk

Contract period

5 Dec 2026 → …

Regime

publicSector

Category

supplies